Composite Carbon Nanotube-based Structures And Methods For Removing Heat From Solid-state Devices

Abstract

One embodiment involves an article of manufacture that includes: a copper substrate plug with a front surface and a back surface; a catalyst on top of a single surface of the copper substrate plug; and a thermal interface material on top of the single surface of the copper substrate plug. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate plug. The copper substrate plug is configured to be incorporated in a peripheral structure of a heat spreader or a heat sink. In another embodiment, the thermal interface material is on top of both the top and bottom surfaces of the copper substrate plug.


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Document History
  • Publication: Oct 9, 2008
  • Application: Mar 31, 2008
    WO US 2008/0058918 W
  • Priority: Mar 28, 2008
    US US 5855208 A
  • Priority: Jan 2, 2008
    US US 1865008 P
  • Priority: Mar 30, 2007
    US US 90939907 P

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