Double Layer Carbon Nanotube-based Structures And Methods For Removing Heat From Solid-state Devices

  • Published: Nov 29, 2007
  • Earliest Priority: May 16 2006
  • Family: 3
  • Cited Works: 0
  • Cited by: 0
  • Cites: 0
  • Additional Info: Full text
Abstract

Carbon nanotube-based structures and methods for removing heat from solid-state devices are disclosed. In one embodiment, a copper substrate has thermal interface materials on top of front and back surfaces of the copper substrate. Each thermal interface material (TIM) comprises a layer of carbon nanotubes and a filler material located between the carbon nanotubes. The summation of the thermal resistance of the copper substrate, the bulk thermal resistance of each TIM, the contact resistance between each TIM and the copper substrate, the contact resistance between one TIM and a solid-state device, and the contact resistance between the other TIM and a heat conducting surface has a value of 0.06 cm<SUP>2</SUP>K/W or less.


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Document History
  • Publication: Nov 29, 2007
  • Application: May 16, 2007
    WO US 2007/0069084 W
  • Priority: May 15, 2007
    US US 74912807 A
  • Priority: Mar 29, 2007
    US US 90896607 P
  • Priority: Dec 12, 2006
    US US 87457906 P
  • Priority: May 16, 2006
    US US 80093506 P

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