Carbon Nanotube-based Structures And Methods For Removing Heat From Solid-state Devices

  • Published: Jul 24, 2008
  • Earliest Priority: May 16 2006
  • Family: 2
  • Cited Works: 2
  • Cited by: 0
  • Cites: 5
  • Additional Info: Cited Works Full text
Abstract

Thermally conductive devices including carbon nanotubes for dissipating heat from solid-state devices are disclosed. The nanotube elements of the invention may be characterized using Raman spectroscopy, and accepted or rejected based on the ratio of the D peak to the G peak of the spectrum. The thermally conductive devices may further include a phase change material that increases lateral heat conduction between the carbon nanotubes.


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Document History
  • Publication: Jul 24, 2008
  • Application: May 16, 2007
    WO US 2007/0069080 W
  • Priority: May 15, 2007
    US US 74911607 A
  • Priority: Dec 12, 2006
    US US 87457906 P
  • Priority: Oct 24, 2006
    US US 86266406 P
  • Priority: May 16, 2006
    US US 80093506 P

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