Composite Carbon Nanotube-based Structures And Methods For Removing Heat From Solid-state Devices

  • Published: Jan 8, 2009
  • Earliest Priority: Mar 30 2007
  • Family: 3
  • Cited Works: 0
  • Cited by: 23
  • Cites: 8
  • Additional Info: Full text
Abstract

One embodiment involves an article of manufacture that includes: a copper substrate plug with a front surface and a back surface; a catalyst on top of a single surface of the copper substrate plug; and a thermal interface material on top of the single surface of the copper substrate plug. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate plug. The copper substrate plug is configured to be incorporated in a peripheral structure of a heat spreader or a heat sink. In another embodiment, the thermal interface material is on top of both the top and bottom surfaces of the copper substrate plug.


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Document History
  • Publication: Jan 8, 2009
  • Application: Mar 28, 2008
    US US 5855208 A
  • Priority: Mar 28, 2008
    US US 5855208 A
  • Priority: Jan 2, 2008
    US US 1865008 P
  • Priority: May 15, 2007
    US US 74911607 A
  • Priority: May 15, 2007
    US US 74912607 A
  • Priority: May 15, 2007
    US US 74912807 A
  • Priority: Mar 30, 2007
    US US 90939907 P
  • Priority: Mar 29, 2007
    US US 90896607 P
  • Priority: Mar 26, 2007
    US US 90816107 P
  • Priority: Dec 29, 2006
    US US 61844106 A
  • Priority: Dec 12, 2006
    US US 87457906 P
  • Priority: Oct 24, 2006
    US US 86266406 P
  • Priority: Aug 2, 2006
    US US 49840806 A
  • Priority: Mar 21, 2006
    US US 38625406 A
  • Priority: Mar 21, 2005
    US US 66322505 P
  • Priority: Aug 24, 2004
    US US 92582404 A
  • Priority: Aug 25, 2003
    US US 49784903 P

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