Apparatus And Method For The Application Of Prescribed, Predicted, And Controlled Contact Pressure On Wires

  • Published: Jan 10, 2008
  • Earliest Priority: Aug 17 2005
  • Family: 7
  • Cited Works: 0
  • Cited by: 0
  • Cites: 13
  • Additional Info: Full text
Abstract

The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems. An apparatus for taking advantage of the characteristics of wires in packaging of a device, such as a semiconductor device, is disclosed. Methods for the prediction of such a behavior for pre-buckling, buckling, and post-buckling conditions in wires, carbon nanotubes (CNTs), and similar wire-grid-array (WGA) structures, for example are also disclosed.


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Document History
  • Publication: Jan 10, 2008
  • Application: Sep 21, 2007
    US US 85947707 A
  • Priority: Sep 21, 2007
    US US 85947707 A
  • Priority: Aug 17, 2005
    US US 20709605 A
  • Priority: Oct 5, 2004
    US US 61560104 P

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