Semiconductor Element Mounting Substrate, Semiconductor Device Using The Same, And Process For Producing Semiconductor Element Mounting Substrate

  • Published: Oct 1, 2008
  • Earliest Priority: Dec 28 2005
  • Family: 10
  • Cited Works: 0
  • Cited by: 2
  • Cites: 0
  • Additional Info:
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Abstract

The invention provides a semiconductor element mounting substrate that, by virtue of an improvement in thermal conduction efficiency between the substrate and another member, can reliably prevent, for example, a light emitting element such as a semiconductor laser from causing a defective operation by heat generation of itself, by taking full advantage of high thermal conductivity of a diamond composite material. In the semiconductor element mounting substrate, a connecting surface to be connected with the light emitting element or the like is finished such that the number, per unit area, of at least either recesses or protrusions having a depth or height of 10µm to 40µm and a surface-direction diametrical size of 10µm to 3mm is 50/cm 2 or less, and on the connecting surface, a coating layer, which is formed of a solder or a brazing material, has a thickness of 1µm to 30µm, an arithmetic mean roughness R a of a roughness curve showing a surface roughness of R a ‰ 2µm, and a maximum height roughness R z of R z ‰ 15µm, and fills and covers the recesses or protrusions, is formed.


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Document History
  • Publication: Oct 1, 2008
  • Application: Dec 21, 2006
    EP EP 06843018 A
  • Priority: Dec 21, 2006
    JP 2006325544 W
  • Priority: Dec 28, 2005
    JP 2005380007 A

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