Single Layer Carbon Nanotube-based Structures And Methods For Removing Heat From Solid-state Devices

  • Published: Jun 5, 2008
  • Earliest Priority: May 16 2006
  • Family: 3
  • Cited Works: 0
  • Cited by: 23
  • Cites: 5
  • Additional Info: Full text
Abstract

One embodiment includes: a copper substrate; a catalyst on top of a single surface of the copper substrate; and a thermal interface material on top of the single surface of the copper substrate. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate. The thermal interface material has: a bulk thermal resistance, a contact resistance between the thermal interface material and the copper substrate, and a contact resistance between the thermal interface material and a solid-state device. The summation of the bulk thermal resistance, the contact resistance between the thermal interface material and the copper substrate, and the contact resistance between the thermal interface material and the solid-state device has a value of 0.06 cm<SUP>2</SUP>K/W or less.


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Document History
  • Publication: Jun 5, 2008
  • Application: May 15, 2007
    US US 74912607 A
  • Priority: May 15, 2007
    US US 74912607 A
  • Priority: Mar 26, 2007
    US US 90816107 P
  • Priority: Dec 29, 2006
    US US 61844106 A
  • Priority: Dec 12, 2006
    US US 87457906 P
  • Priority: Aug 2, 2006
    US US 49840806 A
  • Priority: May 16, 2006
    US US 80093506 P
  • Priority: Mar 21, 2006
    US US 38625406 A

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