Apparatus And Method For The Application Of Prescribed, Predicted, And Controlled Contact Pressure On Wires


The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems. An apparatus for taking advantage of the characteristics of wires in packaging of a device, such as a semiconductor device, is disclosed. Methods for the prediction of such a behavior for pre-buckling, buckling, and post-buckling conditions in wires, carbon nanotubes (CNTs), and similar wire-grid-array (WGA) structures, for example are also disclosed.

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Document History
  • Publication: Oct 28, 2008
  • Application: Sep 21, 2007
    US US 85947707 A
  • Priority: Sep 21, 2007
    US US 85947707 A
  • Priority: Aug 17, 2005
    US US 20709605 A
  • Priority: Oct 5, 2004
    US US 61560104 P

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