Semiconductor Device And Method Of Manufacturing The Same

  • Published: Sep 10, 2008
  • Earliest Priority: Mar 08 2007
  • Family: 4
  • Cited Works: 0
  • Cited by: 0
  • Cites: 1
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Abstract

A semiconductor device (100) includes: a semiconductor chip (2) including: a first main face (2I) having an edge portion, a second main face (2II) locating the opposite side to the first main face (2I), a crystalline defect region (4, 5) present within a region including at least the edge portion being adjacent to the first main face (2I), the crystalline defect region (4, 5) being configured to have lower stress than the stress in the other semiconductor region (6) for the same strain; and a metallic substrate (1) to be bonded via a bonding member (3) to the fust main face (2I) of the semiconductor chip (2).


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Document History
  • Publication: Sep 10, 2008
  • Application: Mar 5, 2008
    EP EP 08004084 A
  • Priority: Oct 26, 2007
    JP 2007278693 A
  • Priority: Mar 8, 2007
    JP 2007058505 A

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