Carbon Nanotube-based Structures And Methods For Removing Heat From Solid-state Devices

  • Published: Nov 29, 2007
  • Earliest Priority: May 16 2006
  • Family: 2
  • Cited Works: 0
  • Cited by: 2
  • Cites: 0
  • Additional Info: Full text Published
Abstract

One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at ~1350 cm<SUP>-1</SUP> with an intensity I<SUB>D</SUB>, a G peak at ~1585 cm<SUP>-1</SUP> with an intensity I<SUB>G</SUB>, and an intensity ratio I<SUB>D</SUB> / I<SUB>G</SUB> of less than 0.7 at a laser excitation wavelength of 514 nm. The thermal interface material has: a bulk thermal resistance, a contact resistance at an interface between the thermal interface material and the copper substrate, and a contact resistance at an interface between the thermal interface material and a solid-state device. A summation of these resistances has a value of 0.06 cm<SUP>2</SUP>K/W or less.


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Document History
  • Publication: Nov 29, 2007
  • Application: May 16, 2007
    WO US 2007/0069080 W
  • Priority: May 15, 2007
    US US 74911607 A
  • Priority: Dec 12, 2006
    US US 87457906 P
  • Priority: Oct 24, 2006
    US US 86266406 P
  • Priority: May 16, 2006
    US US 80093506 P

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